Ipc 600 S-7 To S-10

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Subsurface imperfections in board material

Back 1

such as delamination, blistering, and foreign inclusions.

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Subsurface imperfections to multilayer printed boards

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such as voids, delamination, blistering, cracks, ground plane clearance and layer to layer spacing.

Front 3

Plated-through hole anomalies

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including size, annular ring, nailheading, plating thickness, plating voids, nodules, cracks, resin smear, inadequate or excessive etchback, wicking, inner layer (post) separation, and solder resist thickness.

Front 4

Internal conductor anomalies

Back 4

such as over or under etch, conductor cracks and voids, uneven or inadequate oxide treatment, and foil thickness.

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Visual observations

Back 5

made on cross-sections only.

Front 6

Registration of conductors

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is typically determined with respect to plated-through hole lands.

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Minimum dielectric thickness

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is the maximum material condition used for the electrical voltage dielectric strength requirements.

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Smear removal

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is defined as the removal of resins debris which results from the formation of the hole.

Front 9

Metal planes

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are used for mechanical reinforcement and/or electromagnetic shielding for printed boards

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Minimum dielectric thickness

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is the maximum material condition used for the electrical voltage dielectric strength requirements.

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Resin recession in a plated-through hole

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is generally defined as a separation between the plated barrel of the hole and the dielectric material on the hole wall.

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Outgrowth

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The increase in conductor width at one side of the conductor, caused by plating buildup over that delineated by theproduction master.

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Undercut

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The distance on one edge of the conductor measured parallel to the board surface from the outer edge of the conductor, including etch resists, to the maximum point indentation to the copper conductor.

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Overhang

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The sum of the outgrowth and undercut

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Design width of conductor

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The width of a conductor as delineated or noted on the procurement documentation

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Production Master

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A 1 to 1 scale pattern which is used to produce one or more printed boards within the accuracy specifiedon the Procurement Documentation.

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Etch Factor

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The ratio of the depth of etch to the amount of lateral etch.

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Laminated Type Metal Core Board

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Single conductive layer on both sides and insulated from themetal core substrate. Conductive material to be copper foiland electrodeposited copper.

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The following general rules minimize surface contaminants when handling printed boards:

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1. Work stations should be kept clean and neat.

2. There should be no eating, drinking or use of tobacco products at the work station or other activities that are likely to causecontamination of the board surfaces.

3. Hand creams and lotions containing silicone should not be used since they could result in solderability and other processingproblems. Specially formulated lotions are available.

4. Handling of boards by their edges is desirable.5. Lint free cotton or disposable plastic gloves should be used when handling bare boards. Gloves should be changed frequentlyas dirty gloves can cause contamination problems.6. Unless special racks are provided, stacking boards without interleaving protection should be avoided.

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Laminated Type Metal Core Multilayer Board

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More than one conductive layer on one or both sides andinsulated from the metal core substrate. Conductive materialto be copper foil and electrodeposited copper.

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Annular Ring - Internal Layers

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Front 22

"Clearance Hole, Unsupported, to Power or Ground Planes"

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Front 23

CONDUCTIVE PATTERNS - GENERAL - Print and Etch

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Front 24

Core Bond to Plated-Through Hole Wall

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Front 25

"Cracks in Insulation Material Fill, Laminated Type"

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Front 26

DIELECTRIC MATERIAL - Delamination or Blister

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Front 27

"DIELECTRIC MATERIAL - Dielectric Material, Clearance, Metal Plane for Supported Holes"

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Front 28

DIELECTRIC MATERIAL - Etchback

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Front 29

DIELECTRIC MATERIAL - Layer-to-Layer Spacing

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Front 30

DIELECTRIC MATERIAL - Negative Etchback

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Front 31

DIELECTRIC MATERIAL - Resin Recession

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Front 32

DIELECTRIC MATERIAL - Smear Removal

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Front 33

FLEXIBLE AND RIGID-FLEX PRINTED WIRING - Access Hole Registration for Coverlayer and Stiffeners

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Front 34

FLEXIBLE AND RIGID-FLEX PRINTED WIRING - Adhesive Squeeze-Out - Foil Surface

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FLEXIBLE AND RIGID-FLEX PRINTED WIRING - Adhesive Squeeze-Out - Land Area

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Front 36

FLEXIBLE AND RIGID-FLEX PRINTED WIRING - Coverlayer Coverage - Coverfilm Separations

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Front 37

FLEXIBLE AND RIGID-FLEX PRINTED WIRING - Etchback (Type 3 and Type 4 Only)

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Front 38

FLEXIBLE AND RIGID-FLEX PRINTED WIRING - Laminate Integrity - Flexible Printed Wiring

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Front 39

FLEXIBLE AND RIGID-FLEX PRINTED WIRING - Laminate Integrity - Rigid-Flex Printed Wiring

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Front 40

FLEXIBLE AND RIGID-FLEX PRINTED WIRING - Laminate Integrity

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Front 41

FLEXIBLE AND RIGID-FLEX PRINTED WIRING - Plating Defects

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Front 42

FLEXIBLE AND RIGID-FLEX PRINTED WIRING - Smear Removal (Type 3 and 4 Only)

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Front 43

FLEXIBLE AND RIGID-FLEX PRINTED WIRING - Solder Wicking_Plating Migration Under Coverlayer

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Front 44

FLEXIBLE AND RIGID-FLEX PRINTED WIRING - Stiffener Bonding

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Front 45

"FLEXIBLE AND RIGID-FLEX PRINTED WIRING - Transition Zone, Rigid Area to Flexible Area"

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Front 46

FLEXIBLE AND RIGID-FLEX PRINTED WIRING - Trimmed Edges_Edge Delamination

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Front 47

FLUSH PRINTED BOARDS - Flushness of Surface Conductor

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Front 48

Innerlayer Separation - Horizontal (Transverse) Microsection

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Front 49

Innerlayer Separation - Vertical (Axial) Microsection

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Front 50

Insulated-Metal-Substrate Metal Core Board

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"Insulation Material Fill, Laminated Type Metal Core"

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Front 52

Laminate Voids (Outside Thermal Zone)

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Laminated Type Metal Core Board

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Front 54

Laminated Type Metal Core Multilayer Board

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Front 55

"METAL CORE PRINTED BOARDS - Insulation Thickness, Insulated Metal Substrate"

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Front 56

METAL CORE PRINTED BOARDS - Spacing Laminated Type

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Front 57

PLATED-THROUGH HOLES - DRILLED - Burrs

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PLATED-THROUGH HOLES - DRILLED - Nailheading

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PLATED-THROUGH HOLES - GENERAL - Copper Plating Thickness - Hole Wall

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PLATED-THROUGH HOLES - GENERAL - Foil Crack (External Foil)

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PLATED-THROUGH HOLES - GENERAL - Plating Crack - (Corner) ``F'' Crack

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PLATED-THROUGH HOLES - GENERAL - Plating Nodules

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PLATED-THROUGH HOLES - GENERAL - Plating Voids

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PLATED-THROUGH HOLES - GENERAL - Solder Coating Thickness (Only When Specified)

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Front 65

PLATED-THROUGH HOLES - GENERAL - Solder Resist Thickness

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Front 66

"PLATED-THROUGH HOLES - GENERAL - Wicking, Clearance Holes"

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PLATED-THROUGH HOLES - PUNCHED - Flare

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Front 68

PLATED-THROUGH HOLES - PUNCHED - Roughness and Nodules

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Front 69

Wicking

Back 69

Front 70

PLATED-THROUGH HOLES - GENERAL - Annular Ring - Internal Layers

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Front 71

PLATED-THROUGH HOLES − GENERAL - Plating Crack − (Barrel) ‘‘E’’ Crack

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Front 72

PLATED-THROUGH HOLES - GENERAL - Lifted Lands - (Cross-Sections)

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Front 73

PLATED-THROUGH HOLES - GENERAL - Foil Crack - (Internal Foil) ``C'' Crack

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