Cid

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DFX

Back 1

Design For Excellence

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DFX1

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Design for Producibility and Reliability

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It involves all the disciplines needed to manufacture and maintain an electronic product

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DFX

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IPC 2581

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Heart of the electronics industry product realization

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Design

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It is where the reality of that product vision begins to takes shape

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Design Phase

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4 Design Requirements

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Performance

Cost

Reliability

DFX

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DFM

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Design for Manufacturing

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DFA

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Design for Assembly

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DFT

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Design for Test

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DFR

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Design for Reliability

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DFE

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Design for the Environment

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3 IPC Structures

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Performance Classes

Producibility Levels

Board Types

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Class where major requirement is funcrionality

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Class 1

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Environment may necessitate different:

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Materials

Tolerance

Final Product Configuration

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Established to help communicate the design complexity of wthe manufacturers

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Producibility Levels

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A printed board can have _________________ for different dedign features

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Different producibility levels

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Types of Rigid Boards

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1 Single-Sided PCB

2 Double-Sided PCB

3 Multilayer Board without Blind or Buried Vias

4 Multilayer Board with Blind or Buried Vias

5 Multilayer Metal-Core Board without Blind Buried Vias

6 Multilayer Metal-Core Board with Blind Buried vias

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They are important for proper circuit functioning and to assure all the physical requirements of the assembly are met

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Component Locations

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An efficient placement facilitates a ________________________ and assures the design will meet

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quality routing of signal conductors

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Acts as the hub of board design

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PCB Designer

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Lialison between all groups, balancing demands so all requirements are met

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Printed Voard Designer

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Components are usually placed in

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Rows and Colums

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Space between the components placement

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Routing Channels

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Support efficient fanout via

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Rows and columns of components with adequate space between

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Allows connections from surface lands to internal circuitry on a predictable and testable grid

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Fanout vias

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Permits the designer to move components to different locations to improve interconnection pathways, plan the shortest connection paths, show component lands that have not been connected and signal flow.

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Rat's Nest View

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Required for unused logic pins

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Pull-up or pull-down resistors

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Composed of components that can provide state information 1 or 0 as a function of the overall circuit

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Digital Circuits

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Characterized by high pin count components that produce many signals

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Digital Designs

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Routing of return circuitry is considered first and the signal routing second

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Digital Designs

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Usually made up of discrete devices, and provide the waveform characteristics necessary to describe a circuit

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Analog Circuits

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Characterized by low-pin count compinents with just a few signals per components

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Analog Designs

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Component locations must be compatible with any defined

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Height restrictions

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Flow of electricity ina an electronic system

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Current

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Maximum Current that can be carried continuously by a conductor without degradation of the product

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Current Carrying Capacity

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Property of conductors that resist the flow of electrons

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Resistance

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Has a very low resistance to current flow

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Copper

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Ideal conductive materials

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Low resistance to electricity

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Useful in determining heat rise of conductors that are required to carry heavy currents

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Ohm's Law

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By-product of power or work

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Heat

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Conversion of energy from one form to another

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Power

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Formula of power

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Front 44

When current flows through a wire or trace, it generates

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Electeic field and magnetic field

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Magnetic field lines around a long wire which carries an electeic current form_____

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Concentric circles around the wire

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Unwanted radiated electro-magnetic energy that couples into electrical conductors

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EMI

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The use of ____________ can also reduce electeo-magnetic interference upon devices, circuits or portions of circuits

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Return or voltage planes as shields

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Act as shields to prevent crosstalk between traces in the z-axis

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Plane Layers

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External plane layers can

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Protect from stray EMI

Minimize EMI Emissions

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Copper Clad Laminated are made up of

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Resin System

Reinforcement

Copper foil

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Sheets of reinforcement coated with resin

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Prepreg or B stage

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Fully cured material

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Core

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Partially cured material

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Pre-preg

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Most popular reinforcement

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Woven Glass

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Provides structural strength and can be organic or inorganic

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Reinforcement

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Most popular resin system

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Epoxy

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Natural or synthetic resinous material

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Resin System

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Lead Free soldering means

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Higher Temperature diring processing

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Drives the need for higher temperature laminate

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Lead free soldering

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Added to epoxy resin in order to make it more stable

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Additional properties as fillers

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Dielectric or insulated metal sheet

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Base material

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Base material can be

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Rigid

Flexible

Rigid Flex

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Most common thickness of laminate cores of rigid base for multi layers

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4, 8, 5, 10

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Minimum thickness of rigid base material for multi-layer boards

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2 mils

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Most common type of copper on rigid printed boards

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Electrodeposited ED

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Wrought

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Rolled Annealed

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Used for flex circuits because of its superior ductility

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Rolled Annealed

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Shape of etched traces are

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Trapezoidal

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Copper lost during etch

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1/2 mil per side per ounce if copper

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The mechanical mechanism that holds the copper to the base material

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Resin

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Happens when there's insufficient resin to provide dielectric integrity and stress relief

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Glass Crush

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More expensove than foil construction

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Core construction

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Construction often used for boards needing to meet tightly controlled impedance requirements

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Core construction

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Construction for most rigid boards and preferred by vendors

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Foil construction

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It is common practice for fabricators to compensate the original electronic data when they create their production floor film to account for their process variations

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FYI 😊

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Core material __________ during etch processes depending on how much total copper is removed

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Shrinks

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It forces the fabricator to make major adjustments to your film

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Unbalanced copper distribution on layers

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The board stackup should mirror around _________ in the z axis to prevent ____________

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Centerline, warpage

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Manifests as Bow and Twist

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Warpage

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Undesirable deviations from a printed board's flatness

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Bow and twist

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All four corners are in same plane

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Bow

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Only three corners are in same plane

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Twist

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Maximum vertical displacement for bow and twist diagonal length for SMT

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0.75%

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Maximum vertical displacement for bow and twist diagonal length for SMT

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1.5%

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Interfacial connections

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Plated Thru Holes

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Plated holes are drilled ________ larger than the finished hole size for plating requirements

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2 to 4 mils

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Processes that prepare the hole wall for electroless copper deposition

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Desmear and Etchback

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Removes only resin smeared over the exposed ends of conductors due to drill heat

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Desmear

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Remive sopper burrs after drilling

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Deburring

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Controlled removal of nonmetallic materials from the hole walls

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Etchback

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Removes resin smear, exposes internal condyctor surfaces for plating

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Etchback

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Used on pcb for component thru holes and vias fully circumscribe the hole

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Lands

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Minimun desired amount of copper material left around the hole after processing

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Annular ring requirement

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Considers production tooling tolerances and process variations in order to meet the requirements of a fabricated board

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Fabrication Allowance

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Drill sizes come in increments of

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2 mils

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Three different methodology for hole locations

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Bilateral Tolerance Zone

Positional Tolerance Zone

Bonus Tolerance Zone

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Holes are at the smallest

Pins are at maximum

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MMC

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Holes at maximum size

Pins at smallest size

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LMC

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Holes in boards are produces using

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Mechanical drilling or laser drilling

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Holes mostly with CEM

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Punching

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If a desired drill size falls between readily available standard drill bit size

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Round up to a larger size

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# of drill size per board as sweet spot

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10 drill sizes

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Bilateral tolerances for finished hole Level A

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0.0079"

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Bilateral tolerances for finished hole Level B

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0.006

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Bilateral tolerances for finished hole Level C

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0.004

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Used as starting base for all rigid pcb

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Copper clad laminate

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Metal clad material with copper as the conductive material

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Copper clad laminate

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Etch Factor

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V/X

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Occurs when the plating thickness exceeds the resist thickness

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Outgrowth

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Also used as a method to remove heat from the components

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Copper

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To accomodate variations in registration of the different conductive layers or hole locations

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Manufacturing allowance

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A land on a specific layer that has no connection on that layer

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Non functional pad

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For layers greater than ________, it is recommended to remove non functional pad

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10 layers

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Large conductive areas ______ or larger covered with _____ increases the blistering warping or heat shielding during wave or reflow

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118 mils, solder mask

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Large areas more than ______ diameter may be broken up into a ______

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1.00", crosshatched