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3 Cards in this Set
- Front
- Back
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CB Layout
Your supply the schematics, we will draw the gerber file then finish the Printed Circuit Board. Our engineers can also conduct thorough reviews of your existing design and often recommend cost-saving suggestions, based on proto-type or full run requirements. PCB Manufacturing Service Double-sided, Multi-layer Printed Circuit Boards Prototype, Pre-production and Medium to High Volume Production. 24 Hours Rush Delivery Electrical Testing |
Surface Mount Assembly
We offers surface mount technology (SMT) assembly services from proto-type through medium and high volume production, including fine pitch component. Surface mount capabilities include: Semiautomatic Screen Printing Place Component upto 19 mil Pitch Prototype, Medium to High Volume Production Assembly FR4, Aluminum, PI Single and Double Sided Assembly Mixed Technology(Tjrough Hole & SMT) ESD Controlled Area |
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Through Hole Assembly
PCB Assembly provides through hole or mixed technology assembly solutions. Wave soldering is accomplished with the latest sophisticated equipment. Our Through hole assembly capabilities include: Full Through-Hole Assembly Line Prototype, Medium to High Volume Production Assembly ESD Controlled Area |
Reverse Engineering of Electronic Products
We has developed capabilities of generating the necessary manufacturing documentation from finished products. Services include: Artwork and PCB Scanning Schematics and Gerber File Generation Bill of Material and Parts List Generation |
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- Engineering Services- PCB Design & Assembly- Product Design- Prototyping- Cable and Wire Assemblies- Plastics and Molds
pls contact sabrina, skype:zllsabrina |
Technical requirement:
1) Professional Surface-mounting and Through-hole soldering Technology 2) Various sizes like 1206,0805,0603 components SMT technology 3) ICT(In Circuit Test),FCT(Functional Circuit Test) technology. 4) PCB Assembly With UL,CE,FCC,Rohs Approval 5) Nitrogen gas reflow soldering technology for SMT. 6) High Standard SMT&Solder Assembly Line 7) High density interconnected board placement technology capacity. |
