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3 Cards in this Set
- Front
- Back
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PCB Process Capability
*processing layers:1-28 layers *Finished thickness (thinnest - the thickest): 0.008 "~ 0.24" (0.20mm ~ 6.0mm) *Minimum aperture: 6mil (0.15mm) *Minimum line width / spacing :3-4 mil (0.076-0.10mm) *Maximum board size: Single & Double 22 "x 43" (550 x1100mm), Multi-layer 22 "x 25" (550mm x 640mm) *Impedance Control: ± 10% *Surface Treatment: OSP, HASL, Electric Nickel / Gold, Chemical nickel / gold, lead-free HASL , Gold finger, immersion Silver, Immersion Tin. *Base materials: FR4 ( ShengYi, KB, International), high TG (TG150, TG170), halogen-free board (Halogen-free), high frequency plate (Rogers, Teflon, Taconic), made PTFE (PTFE) ,"", AL aluminum plate (Berquist, Al-made basis), copper (Cu Base), Iron (Fe Base), ceramic substrate (Ceramic Base) The quick-turn service 24 hours for 2-Layer sample 48 hours for 4-Layer sample 72 hours for 6-Layer sample |
High frequency pcb,aluminum pcb, bga pcb, teflon rogers pcb, pls contact sabrina, skype:zllsabrina
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HDI pcb
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immersion silver pcb
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half hole pcb
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impedance control pcb
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