K&s Wire Bonding

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Knet/Knet Pro<br />DART

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The industry's most advanced system integration, data acquisition, and recipe management tools are bundled in the full-featured KNetPRO, while all K&S customers can enjoy KNet's basic functionality for FREE with KNetLT.

Software packages to support bonders and other assembly machines. Allows (pro) remote monitoring and control of the machines through the web. Claim reduction of operator errors etc.<br />DART= Data Archiving and Reporting allows monitoring of UP time etc.

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Knet/Knet Pro
DART

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Software packages to support bonders and other assembly machines. Allows (pro) remote monitoring and control of the machines through the web. Claim reduction of operator errors etc.
DART= Data Archiving and Reporting allows monitoring of UP time etc.

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Auto OLP 2006

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Combine AutoOLP 2006 CAD software with any AOLPLoadSM equipped K&S wire bonder for precise, accurate bonding of your most difficult packages:
Package Challenges The Solution
Closely spaced bond pads
Staggered bonds
Unusual, irregular bond shapes
Offset bonds to avoid probe marks
Auto OLP 2006 with your AOLPLoad-equipped K&S wire bonder

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Post Bond Inspection (SW)

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The Post Bond Inspection (PBI) System is a software feature that allows you to evaluate the accuracy of your bonding applications, through three main inspection capabilities: Ball Size Ball Placement No Stick On Pad

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LookAhead SW

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LookAhead works with: Matrix devices where optics setup falls within 400 to 800 mils. Low pin count packages. High density leadframes.

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BGA3 SW

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BGA3 Low Loop Premium Process Software is a value-added looping trajectory that enhances your bonder's Operating Software. This value-added process supports your challenging Low Loop BGA packaging requirements.

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Small Ball Detect

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Small Ball Detect will help avoid device damage and yield loss caused by an abnormally small Free Air Ball (FAB). It uses the height of contact (or Z-position) to detect a small FAB during the Z-seek motion of each 1st bond.

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Basic Loop

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This profile is based on standard loop and provides a generic loop shape with a less motions to deliver a higher UPH than standard loop. Best results are obtained for loops that do not exceed 170 mils.

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Contour Motions

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Contour Motions process enhances 2nd bond process control in several ways.

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The Chip Scale Package (CSP)

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The Chip Scale Package (CSP) Loop Premium Process Software is a value-added looping trajectory developed for challenging Chip Scale Package (CSP) applications. CSP is optimized for wires in the range of 10-25 mils in length, and used mainly where there is a small clearance between die & lead

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7k wires

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The wire limit is a dynamic number that determines how many wires the operator is permitted to teach. A new memory management system enables an increase in wire count for K&S wire bonders.

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BGA2

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BGA2 Loop Premium Process Software is a Standard looping trajectory developed to support your challenging BGA applications

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Flexible Pitch

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Flexible Pitch Process Software is a standard profile that operates with the K&S Bonder Operating Software.

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The Free Air Ball II

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The Free Air Ball Diagnostic now includes the new Formed Free-Air-Ball profile for use in 2-31 or later software as a tool to produce multiple freestanding cherry-pit Free-Air-Balls.

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Spider Loop

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Spider Loop Trajectory is for applications where the second kink of a wire should be above the first kink.

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Constant Gap

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The K&S Model 8060 Wedge Bonder has a 360 degree rotary bondhead design which allows bond placement at any angle. In the Constant Gap Looping process, bonds on the die can be bonded parallel to th pad and perpendicular to the die edge. This maximizes the space between each bond and prevents an "angled wedge bond" from shorting across smaller pitch pads as in the case of a standard radial bonding set-up.

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iStackPS(TM)

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iStackPS(TM)--a next generation die bonding platform for advanced stacked die and
high-performance ball grid array (BGA) applications. iStack,
iStack is capable of delivering up to 30% productivity increases
over the current generation of die bonding products. iStack joins ICONNPS(TM)
and CONNXPSTM in Kulicke &
Soffa's Power Series line of leading-edge bonding equipment

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ConnX-LEDPSTM

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ConnX-LEDPSTM automatic ball bonder—an extension of the company’s leading ConnXPSTM bonding platform. With new features and enhancements specifically designed for LED applications, ConnX-LED will help K&S customers increase their efficiency and productivity, and meet the challenges of the fast-paced, high growth LED market.

ConnX-LED offers all of the features required for bonding LED packages, including accuracy to +/- 3.5 μm, automatic recovery paths for common production stoppages, programmable back-up power and many others—providing customers with reduced cost of ownership in a highly competitive market space. ConnX-LED joins iStackPSTM, ICONNPSTM ConnX, and ConnX-VLEDPSTM in Kulicke & Soffa’s Power Series platform, the next generation of semiconductor assembly equipment for today’s most challenging applications. Driven by the most powerful X-Y-Z motion control system available on the market, Power Series products deliver the highest levels of speed, accuracy and throughput for reduced cost of ownership for the segment that the respective model serves.

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IConn(PS)

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IConn(PS) replaces Maxum Ultra :Addresses advanced packaging requirements, copper wire bonding, and ultra fine pitch capability.

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ConnX(PS

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ConnX(PS) replaces: Maxum Elite Provide optimal manufacturing capabilities for the lower pin count IC market and the rapidly growing LED market.

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Bonding tools market share

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Over 50% market share

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Bonding tools iCapPSTM

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Looks like improved capilary, denser material has 1.5 times lifetime of normal capilary

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Bonding tools CuPraPlus

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unique geometrical design and material surface properties can achieve a highly consistent and stable fine Copper wire 2nd bond, while maintaining the quality of the overall wire bonding process. CuPRAplus Copper Capillary works together with K&S' iCu Copper wire and bonder kit to provide a complete solution for manufacturers looking to take advantage of the cost advantages offered by copper wire. The CuPRAplus takes fine copper wire bonding a step forward by ensuring both a quality 1st and 2nd bond for superior process control and productivity.

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Second bond issues

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In general, the thinner and finer the lead finger, the more difficult it is to receive a strong and reliable 2nd bond. The stitch bond response can suffer one or more of the following: poor bondability, weak strength (according to wire pull force test), inconsistent strength (large variation) or quality degradation over time. Additionally, the failure rate during the wire bonding process increases and can seriously affect manufacturer’s productivity.

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Bonding tools Fortus

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The Fortus capillary, a K&S Bonding Tools innovation, is specifically designed to address 2nd bond formation challenges, using gold bonding wires on lead-frame based applications and hard metals (i.e. Ni-Pd) plated packages.
The Fortus capillary’s unique design rules and Granular TipTM morphology was developed by K&S Bonding Tools to provide manufacturers with an improved bonding capability on lead-frames based devices that can help to achieve productivity and cost objectives.

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iStackPS(TM)

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iStackPS(TM)--a next generation die bonding platform for advanced stacked die and
high-performance ball grid array (BGA) applications. iStack,
iStack is capable of delivering up to 30% productivity increases
over the current generation of die bonding products. iStack joins ICONNPS(TM)
and CONNXPSTM in Kulicke &
Soffa's Power Series line of leading-edge bonding equipment

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ConnX-LEDPSTM

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ConnX-LEDPSTM automatic ball bonder—an extension of the company’s leading ConnXPSTM bonding platform. With new features and enhancements specifically designed for LED applications, ConnX-LED will help K&S customers increase their efficiency and productivity, and meet the challenges of the fast-paced, high growth LED market.

ConnX-LED offers all of the features required for bonding LED packages, including accuracy to +/- 3.5 μm, automatic recovery paths for common production stoppages, programmable back-up power and many others—providing customers with reduced cost of ownership in a highly competitive market space. ConnX-LED joins iStackPSTM, ICONNPSTM ConnX, and ConnX-VLEDPSTM in Kulicke & Soffa’s Power Series platform, the next generation of semiconductor assembly equipment for today’s most challenging applications. Driven by the most powerful X-Y-Z motion control system available on the market, Power Series products deliver the highest levels of speed, accuracy and throughput for reduced cost of ownership for the segment that the respective model serves.

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IConn(PS)

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IConn(PS) replaces Maxum Ultra :Addresses advanced packaging requirements, copper wire bonding, and ultra fine pitch capability.

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ConnX(PS

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ConnX(PS) replaces: Maxum Elite Provide optimal manufacturing capabilities for the lower pin count IC market and the rapidly growing LED market.

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Bonding tools market share

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Over 50% market share

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Bonding tools iCapPSTM

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Looks like improved capilary, denser material has 1.5 times lifetime of normal capilary

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Bonding tools CuPraPlus

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unique geometrical design and material surface properties can achieve a highly consistent and stable fine Copper wire 2nd bond, while maintaining the quality of the overall wire bonding process. CuPRAplus Copper Capillary works together with K&S' iCu Copper wire and bonder kit to provide a complete solution for manufacturers looking to take advantage of the cost advantages offered by copper wire. The CuPRAplus takes fine copper wire bonding a step forward by ensuring both a quality 1st and 2nd bond for superior process control and productivity.

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Second bond issues

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In general, the thinner and finer the lead finger, the more difficult it is to receive a strong and reliable 2nd bond. The stitch bond response can suffer one or more of the following: poor bondability, weak strength (according to wire pull force test), inconsistent strength (large variation) or quality degradation over time. Additionally, the failure rate during the wire bonding process increases and can seriously affect manufacturer’s productivity.

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Bonding tools Fortus

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The Fortus capillary, a K&S Bonding Tools innovation, is specifically designed to address 2nd bond formation challenges, using gold bonding wires on lead-frame based applications and hard metals (i.e. Ni-Pd) plated packages.
The Fortus capillary’s unique design rules and Granular TipTM morphology was developed by K&S Bonding Tools to provide manufacturers with an improved bonding capability on lead-frames based devices that can help to achieve productivity and cost objectives.

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iStackPS(TM)

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iStackPS(TM)--a next generation die bonding platform for advanced stacked die and
high-performance ball grid array (BGA) applications. iStack,
iStack is capable of delivering up to 30% productivity increases
over the current generation of die bonding products. iStack joins ICONNPS(TM)
and CONNXPSTM in Kulicke &
Soffa's Power Series line of leading-edge bonding equipment

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ConnX-LEDPSTM

Back 36

ConnX-LEDPSTM automatic ball bonder—an extension of the company’s leading ConnXPSTM bonding platform. With new features and enhancements specifically designed for LED applications, ConnX-LED will help K&S customers increase their efficiency and productivity, and meet the challenges of the fast-paced, high growth LED market.

ConnX-LED offers all of the features required for bonding LED packages, including accuracy to +/- 3.5 μm, automatic recovery paths for common production stoppages, programmable back-up power and many others—providing customers with reduced cost of ownership in a highly competitive market space. ConnX-LED joins iStackPSTM, ICONNPSTM ConnX, and ConnX-VLEDPSTM in Kulicke & Soffa’s Power Series platform, the next generation of semiconductor assembly equipment for today’s most challenging applications. Driven by the most powerful X-Y-Z motion control system available on the market, Power Series products deliver the highest levels of speed, accuracy and throughput for reduced cost of ownership for the segment that the respective model serves.

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IConn(PS)

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IConn(PS) replaces Maxum Ultra :Addresses advanced packaging requirements, copper wire bonding, and ultra fine pitch capability.

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ConnX(PS

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ConnX(PS) replaces: Maxum Elite Provide optimal manufacturing capabilities for the lower pin count IC market and the rapidly growing LED market.

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Bonding tools market share

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Over 50% market share

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Bonding tools iCapPSTM

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Looks like improved capilary, denser material has 1.5 times lifetime of normal capilary

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Bonding tools CuPraPlus

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unique geometrical design and material surface properties can achieve a highly consistent and stable fine Copper wire 2nd bond, while maintaining the quality of the overall wire bonding process. CuPRAplus Copper Capillary works together with K&S' iCu Copper wire and bonder kit to provide a complete solution for manufacturers looking to take advantage of the cost advantages offered by copper wire. The CuPRAplus takes fine copper wire bonding a step forward by ensuring both a quality 1st and 2nd bond for superior process control and productivity.

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Second bond issues

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In general, the thinner and finer the lead finger, the more difficult it is to receive a strong and reliable 2nd bond. The stitch bond response can suffer one or more of the following: poor bondability, weak strength (according to wire pull force test), inconsistent strength (large variation) or quality degradation over time. Additionally, the failure rate during the wire bonding process increases and can seriously affect manufacturer’s productivity.

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Bonding tools Fortus

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The Fortus capillary, a K&S Bonding Tools innovation, is specifically designed to address 2nd bond formation challenges, using gold bonding wires on lead-frame based applications and hard metals (i.e. Ni-Pd) plated packages.
The Fortus capillary’s unique design rules and Granular TipTM morphology was developed by K&S Bonding Tools to provide manufacturers with an improved bonding capability on lead-frames based devices that can help to achieve productivity and cost objectives.

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ARCUS Capillary

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Recommended for: Stacked die, quad-tier and other complex, tight tolerance devices.<br /><br />Benefits:<br />Engineered for your most demanding 3D and multi-tier applications<br />Superior wire loop reliability and enhanced repeatability - higher yields<br />Minimizes wire sagging and other common wire challenges - excellent loop formation<br />Improves machine utilization and throughput - maximum productivity<br /><br />The revolutionary NEXXUSTM capillary enables the creation of an inner and outer configuration to reduce wire bonding process-related assists. Fewer assists mean a more robust bonding process, with higher uptime. The NEXXUS was extensively tested on various package types at the K&amp;S laboratories and in mass production sites.<br /><br />

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NEXXUS Capillary

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Recommended for: Fine pitch wire bonded devices, such as QFP and BGA package types.

The revolutionary NEXXUSTM capillary enables the creation of an inner and outer configuration to reduce wire bonding process-related assists. Fewer assists mean a more robust bonding process, with higher uptime. The NEXXUS was extensively tested on various package types at the K&S laboratories and in mass production sites.

Benefits:
Fewer scrapped devices - Higher wire bonding yields
Fewer wire bonder 'assists' - Better wire bonder uptime
Stable bonding process - More accurate production planning & improved factory results

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CIC™ Fine Pitch Capillary

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Benefits
Enabling Technology: The CIC capillary supports the newest ultra-fine pitch processes (50µm bond pad pitch & below), with a proven mass-production capillary solution.
Improved Electrical Performance
The CIC process solution is optimized for thicker wires, resulting in improved device performance.
A Proven, Reliable Process
The CIC process solution has been thoroughly tested for ultra fine pitch performance in the lab and in real-world production.
Higher Yields
- Larger wire diameters mean less wire leaning, better looping, and higher first bond shear results.
- Consistent, repeatable intermetallic coverage reduces pad peeling, cratering and non-stick occurrences.
- The CIC's robust wire bonding process window allows better process portability.

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Sigma II™ Capillary

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Optimized for sensitive and low-K devices

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Wedge Bonding Tools

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Wedge Bonding Tools

K&S manufactures a complete line of standard and custom wedge tools to fit all applications down to 50um and all types of wedge bonding machines. Our wedge tools are selected or specially designed to meet customers' specifications for bond length, shape, surface finish, front & back radius and other criteria affecting bond location, strength and looping. Wedge tools are available in a variety of materials, such as tungsten carbide for aluminum wire applications, titanium carbide for gold wire wedge bonding and fine grain metals for fine pitch applications.

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Wedge Bonding Tools (Heavy Wire)

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Wedge Bonding Tools (Heavy Wire)

K&S wedge tools include the Heavy Wire Wedge (HWW), designed for high power applications to fit all types of HWW bonders. The Heavy Wire Wedge is manufactured using EDM technology and maintains repeatable geometry at all times.
Heavy Wire Wedge bonding is used mainly in high power applications using 3 to 25 mil Aluminum wires. K&S uses EDM manufacturing technology to make precise Heavy Wire Wedge tools with repeatable geometry and optimal performance. The Heavy Wire Wedges are supplied in three different designs: Notch, Easy Guide and No Hole.

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Die Bonding Tools

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Die Bonding Tools

K&S die bonding tools include die collets and pick up tools, manufactured from various metallic (stainless steel, tungsten carbide or titanium carbide) and non-metallic (PVC, MSP, Vespel or Derlin) materials to suit almost any application.
For applications that require extreme positioning accuracy or for eutectic bonding where scrubbing is necessary, K&S offers a wide selection of pyramidical die collets. For applications where chipping is a major factor or where the tool cannot extend beyond the die's edge (epoxy applications) a variety of flat-faced tools is available

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TAB/Magnetic Head Bonding Tools

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TAB/Magnetic Head Bonding Tools

K&S manufactures tools for single point TAB and Magnetic Head bonding to fit all major bonding systems. These tools are designed for lead & wire bonding processes with customized geometry and shape. All tools are manufactured using high-quality, wear-resistant materials, and meet the strictest criteria for precision and repeatability. Our newest development is the L2 µTAB tool (K&S patented technology), optimal for all uBGA applications. The uTAB tool has a specially designed wear resist tip and has proven to reduce lead material build-up rate and significantly increase tool UFG life span.

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Dicing
UniPlus™

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UniPlus™


UniPlus hub Blades enable step function improvement on package singulation quality, precision and productivity by providing significantly longer blade life and improved stability, customized to fit and achieve your process and project requirements.

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Dicing
Blade Pro

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Utility that enables the selection of the appropriate blade based on specific customer requirements

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IMagen

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Features & Benefits:
Allows the customer to stack multiple images and improve the depth field of the microscope
Easily calculate the intermetallic percentage while minimizing variation
Provides live response to ease the intermetallic analysis
Helps gather all data in an orderly fashion exporting / importing data
Enables analyzed image editing

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Die Bonder
iStackPSTM

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iStackPSTM
Kulicke and Soffa introduces iStackPSTM the next generation die bonding platform for advanced stacked die and high performance BGA applications. iStackPS delivers industry leading throughput and best-in-class yields by leveraging unique advances in functionality.

New Heated Bond Process*: reduces voids twice as fast as conventional bond processes.
P→T→P* Processing System: pick and place functions operate in parallel for increased throughput
Dynamic Calibration*: Dispense and bond heads are calibrated. An intermediate staging station with an additional camera provides additional inspection.

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Die Bonding definitions

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What is die bonding?
Die bonding (often referred to as die attach) is the process of attaching a die/chip to a substrate or package. Die attach is accomplished by using one of the following processes:

Eutectic
Solder
Adhesive
Glass or Silver-Glass

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Eutectic die bonding

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Eutectic Bonding
A eutectic bond is formed by melting a preform consisting of a mixture or alloy of two or more dissimilar metals in the joint between the die and substrate. In some cases the die may have a eutectic alloy pre-plated on its back omitting the need for a preform. The preform has a melting point which is lower than the melting point of its base materials. Consider a typical preform composed of gold and silicon. The melting point of gold is 1640� C, and the melting point of silicon is 1414�C. However, when the materials are combined into a preform, the melting point becomes 363� C.
In the eutectic process, the substrate is secured on a heated workstage which operates at a temperature just below the eutectic melting point. When the die and preform are placed on the substrate, the bonder initiates a light scrubbing action with the bond head. This scrubbing generates just enough energy to raise the temperature at the bond site above the eutectic melting point. When scrubbing ceases, the melted material solidifies, thereby creating the bond. Nitrogen is used as a cover gas in order to prevent oxidation due to the high heat.

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Glass /Silver-Glass Bonding

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Glass /Silver-Glass Bonding
A glass bond is formed by adhering the die to the substrate using glass in the form of a paste. The glass paste may also contain silver particles which enhance thermal and electrical conductivity (this is what is called Silver-Glass die bonding).
The Glass bonding process is similar to Adhesive bonding. The differences are the material used and the need for heat. Glass bonds are heated to 350-450�C which melts the glass into a low viscosity liquid. The glass hardens as it cools thereby making the bond.

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Process technologies
Ultra Fine Pitch

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Sub-50µm wire bonding requires a solution approach
The interaction among materials, machine and related issues must be well understood
Issues that are trivial for larger pitch become important yield and quality factors at fine pitch
Process and production robustness are essential to a fine pitch production line
Measurement and process control methods are important to determine process capability

Need combination of Wire bonder
Bonding tools and Wires speciality suited i.e. A whole solution

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Wafer Stud Bumping

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"The gold stud bump flip chip assembly process creates conductive gold bumps on the die bond pads, and connects the die to the circuit board or substrate with adhesive or ultrasonic assembly. Stud bumping requires no under-bump metallization (UBM) and thus does not require wafer processing, so that individual die can be stud bumped as easily they can be wire bonded." (quoted from http://www.flipchips.com/).

Stud bump types include standard stud bump, coined bump, AccuBumpTM and Stacked AccuBump. The interconnect may consist of gold, gold/palladium, copper or solder. Wafer Stud bumping is recommended for applications with low and medium pin count devices, with 400,000 or fewer bumps per wafer.

Typical Packages
Package size reductions will continue to be an important driver for flip chip manufacturing.

Today: Surface Acoustical Wafer (SAW) Filters, Digital Signal Processors, Power Amplifiers

Future: Memory, high-end ASICs, high-end graphics

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Dicing
UniPlus™

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UniPlus™


UniPlus hub Blades enable step function improvement on package singulation quality, precision and productivity by providing significantly longer blade life and improved stability, customized to fit and achieve your process and project requirements.

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Dicing
Blade Pro

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Utility that enables the selection of the appropriate blade based on specific customer requirements

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IMagen

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Features & Benefits:
Allows the customer to stack multiple images and improve the depth field of the microscope
Easily calculate the intermetallic percentage while minimizing variation
Provides live response to ease the intermetallic analysis
Helps gather all data in an orderly fashion exporting / importing data
Enables analyzed image editing

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Adhesive Bonding

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Adhesive Bonding
An adhesive bond is formed by adhering the die to the substrate using some type of adhesive material. It can be electrically insulating or conductive depending on the adhesive material used. Adhesive bonds are conducted at room temperature.
n the adhesive bonding process, the substrate or package is secured to an unheated workstage. The adhesive material is contained in a reservoir and a small amount is metered out onto the substrate, usually in a pattern conforming to the shape and size of the die. The bonder then picks up the die and places it on the adhesive, making the bond. The bond process is complete once the adhesive dries.

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Glass /Silver-Glass Bonding

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Glass /Silver-Glass Bonding
A glass bond is formed by adhering the die to the substrate using glass in the form of a paste. The glass paste may also contain silver particles which enhance thermal and electrical conductivity (this is what is called Silver-Glass die bonding).
The Glass bonding process is similar to Adhesive bonding. The differences are the material used and the need for heat. Glass bonds are heated to 350-450�C which melts the glass into a low viscosity liquid. The glass hardens as it cools thereby making the bond.

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Process technologies
Ultra Fine Pitch

Back 66

Sub-50µm wire bonding requires a solution approach
The interaction among materials, machine and related issues must be well understood
Issues that are trivial for larger pitch become important yield and quality factors at fine pitch
Process and production robustness are essential to a fine pitch production line
Measurement and process control methods are important to determine process capability

Need combination of Wire bonder
Bonding tools and Wires speciality suited i.e. A whole solution

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Wafer Stud Bumping

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"The gold stud bump flip chip assembly process creates conductive gold bumps on the die bond pads, and connects the die to the circuit board or substrate with adhesive or ultrasonic assembly. Stud bumping requires no under-bump metallization (UBM) and thus does not require wafer processing, so that individual die can be stud bumped as easily they can be wire bonded." (quoted from http://www.flipchips.com/).

Stud bump types include standard stud bump, coined bump, AccuBumpTM and Stacked AccuBump. The interconnect may consist of gold, gold/palladium, copper or solder. Wafer Stud bumping is recommended for applications with low and medium pin count devices, with 400,000 or fewer bumps per wafer.

Typical Packages
Package size reductions will continue to be an important driver for flip chip manufacturing.

Today: Surface Acoustical Wafer (SAW) Filters, Digital Signal Processors, Power Amplifiers

Future: Memory, high-end ASICs, high-end graphics

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Low-k Dielectrics

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The insulating capability of low-K materials offers many advantages for fine pitch applications that require increased speed and functionality, but there are also challenges to consider when wire bonding on fragile cu/low-k devices.
Improved IC performance and reduced costs are key drivers in low-k technology's growing momentum. Low-k films support higher circuit speeds and enable smaller feature sizes by increasing the insulation capability around copper interconnects. Wire bonding over active circuitry (BOAC) on copper/low-k metallization layers improves utilization of available silicon space.

However, these new materials have substantially weaker mechanical properties and reduced thermal conductivity compared to previous generations of silicon-dioxide dielectric layers. Successful wire bonding to low-k devices requires optimization of impact forces and ultrasonic energy.
Solution of Dicing, Capillaries and wire is specially selected

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Wafer stud bumber
AT Premier™

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AT Premier™
Advanced Technology Stud Bumper

Copper bumping capability
The new AT Premier™ Stud Bumper from K&S offers many technological advantages that make it the ideal choice for a wide range of flip chip product applications.

Using industry-standard modeling, this new generation high-speed stud bumper is the clear cost-of-ownership leader in comparison to competitive stud bumping technology.
A Premier Value in Cost-of-Ownership

The AT Premier takes stud bumping productivity to a whole new plateau enabling applications that were previously limited to mass solutions. Offering the fastest bumping speeds in the market along with the smallest footprint, AT Premier maximizes the use of resources and clean room space. Stud bumping on the AT Premier platform is flexible enough for rapid prototyping and scalable for production.
Its “premier” performance is highlighted by the following features:
Quantum Leap in Bump Speed
Easy-to-Use & Robust Wafer Mapping
Low-Impact Force for Bond Control
Bump Shape Process Flexibility
Short Product Changeover Time
Smallest Footprint In The Market
Step-and-Repeat and Circle Teach Programming

Wafer Mapping ensures that only good die are bonded.
Wafer Mapping Capabilities identify good die before bonding!
The AT Premier's unique wafer mapping system helps you reduce production costs by bonding only known good die.

K&S has partnered with industry-leader Kinesys ALPS™ software to bring you a flexible Wafer Mapping capability. The system reads the ID for each wafer, accesses the associated wafer map, and bonds only those die designated as good. The updated map is then uploaded once the wafer is fully bonded. The system can be standalone or networked, and wafers can be grouped into lots for maximum production efficiency.

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Wafet stud bumper AT PREMIER AWH

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INTRODUCING THE NEW - AT PREMIER AWH
To complement the industry's most advanced series of stud bumping systems,K&S now offers a new material handling solutions designed to maximize your stud bumping throughput.

The robot first maps the cassette to determine which slots are populated. It can detect cross slotted wafers or double slotted wafers. The operation does not require an operator to ever handle the wafer directly.

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Wafer stud bumper
WaferPRO™ plus

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WaferPRO™ plus
High Speed Large Area Stud Bumper
The world leader in gold ball bonding technology has taken stud bumping speed, precision and flexibility to even greater heights with the introduction of the new WaferPRO™plus Large Area Stud Bumper. The only system that allows single pass processing of 300 mm wafers and can ensure planarity to ±2.5 µm, the K&S WaferPROplus can completely eliminate a separate coining process.

The WaferPRO™ plus Advantage
Up to 22 bumps per second dependent on bump type, size and pitch
±5 µm positional accuracy at 3 sigma
Bump pitch down to 65 µm
Planarity to ±2.5 µm with AccuBump™ feature
Large table travel handles 12” wafers in a single pass
Wide selection of manual chucks and fully-automatic wafer handling options
The AccuBump feature shears the tail from studs, ensuring device planarity to ±2.5 µm. Uniform stack bumping with the versatile WaferPROplus system





High-Speed, Single-Pass Bumping of Wafers to 300 mm!
Speeds of up to 22 bumps per second at pitches down to 65 µm with an accuracy of ±5 µm are just the tip of the iceberg when it comes to describing the cutting edge capability of the WaferPROplus Stud Bumping System. With the largest table travel in the industry (400 mm x 330 mm), the WaferPROplus can handle 300 mm wafers in a single pass, without rotation or the need to load a separate bumping program.

In addition, when supplied with our innovative AccuBump™ feature, studs are sheared to a uniform planarity of ±2.5 µm, eliminating the need for a separate coining operation and dramatically increasing throughput. With a complete line of fully automatic material handling solutions and manual chucks, the WaferPROplus is the industry’s most flexible and affordable wafer bumping solution.

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Manual Ball Bonder:4700

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Manual Ball Bonder:4700
The NEW Model 4700 Allows Ball-Wedge and Wedge-Wedge Bonding Cycles on ONE Machine
The new Model 4700 Convertible Dual-Process Machine is based on K&S proven 4500-Series, the market leader for nearly a decade.
The 4700 features analog dials for ease of use, combining the best features of the workhorse 4523 and 4524 models. Wedge or Capillary mounting is easy and precise with a special transducer, unique to K&S Model 4700. Applications ranging from the basic type to the most challenging are handled with ease and with the versatility demanded by today's leading research or production requirements.
No tools required for changeover, just swing the NEFO assembly to the proper position and press a switch to select ‘Ball Bonding' or ‘Wedge Bonding' process.
(Note: capillary, wedge and/ or bond wire must be loaded for proper operation).
Wedge-wedge and ball-wedge bonding on the same machine
-Fast changeover by operator with no tools
-Bonding mode changed by control panel switch
Special K&S proprietary transducer for proper bond tool mounting
-Ball bonding capillary mounts with split clamp
-Wedge bonding tool mounts with set screw
90-degree deep access wedge bonding with 12.5 mm ‘Z' Axis travel
-Ball bonding 12.5 mm ‘Z' Axis travel
-Special K&S proprietary swingarm EFO/ Drag Arm assembly
High-end Negative EFO with missing ball detection
PLL Ultrasonic Generator
High Q 60kHz Ultrasonic Transducer
2 Channel Independent Bonding Parameters
Semi-Auto and Manual Z Bonding Modes
Built-in Digital Work Stage Temperature Control