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238 Cards in this Set
- Front
- Back
BIOS
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Data and instructions stored on special ROM (read-only memory) chips on the board.
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Firmware microchip or ROM BIOS
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A hybrid of hardware and software containing programs embedded into the chip.
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The motherboard ROM BIOS serves three purposes:
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1. The BIOS used to manage simple devices is called system BIOS.
2. The BIOS used to start the computer is called start up BIOS. 3. The BIOS used to change settings on the mobo is called BIOS setup or CMOS setup. |
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Where are motherboard settings stored?
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In a small amount of RAM located on the firmware chip (CMOS RAM).
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What is an adapter card?
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An adapter card is a circuit board that holds microchips, or integrated circuits (ICs), and the circuitry that connects these chips.
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Motherboard
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The largest and most important circuit board in a computer.
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Peripheral device
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A device that is not installed directly on the motherboard.
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S/PDIF
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A Sony-Philips Digital Interface sound port connects to an external home theater audio system, providing digital output and the best signal quality.
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Chipset
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A group of microchips on the motherboard that control the flow of data and instructions to and from the processor.
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Traces
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Circuits or paths that enable data, instructions, and power to move from component to component on the board.
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Bus
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A system of pathways used for communication and the protocol and methods used for transmission.
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Protocol
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A set of rules and standards that any two entities use for communication.
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Data path size
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The width of a data bus.
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System or Front Side Bus (FSB)
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The main bus on the motherboard that communicates with the CPU, memory, and the chipset.
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The four basic functions of the microcomputer are?
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Input, output, processing, and storage.
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CMOS
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Complementary metal-oxide semiconductor.
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Common ports on a computer?
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Network, FireWire, sound, serial, parallel, USB, keyboard, and mouse ports.
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System clock
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Used to synchronize activity on the motherboard.
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Windows 3.x
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Served as a user-friendly intermediate program between DOS, applications, and the user but did not perform OS functions.
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First Windows OS to allow multiple logins?
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Windows XP
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Four functions of an OS
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Function 1. Provide a user interface
Function 2. Manage files Function 3. Manage hardware Function 4. Manage applications |
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Every operating system has three main internal components:
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The shell, the kernel, and configuration data.
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Shell
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The portion of an OS that relates to the user and to applications.
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Kernel
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Is responsible for interacting with hardware.
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Configuration data
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Information the OS keeps about hardware, applications, data, and users.
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The kernel has two main components.
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The HAL (hardware abstraction layer) is the layer closest to the hardware and the executive services interface between the subsystems in user mode and the HAL.
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Thread
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A single task, such as the task of printing a file, that the process requests from the kernel.
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Process
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A program that is running, together with the system resources assigned to it.
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Device drivers
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Small programs stored on the hard drive that tell the computer how to communicate with a specific hardware device such as a printer, network card, or modem.
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Three categories of processors:
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1. 32-bit processors (x86)
2. Processors that use underlying 32-bit processing with 64-bit instructions. (x86-64bit) 3. 64-bit processors (IA64) |
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An operating system
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manages hardware, runs applications, provides an interface for users, and stores, retrieves, and manipulates files.
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Every OS is composed of two main internal components:
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a shell portion to interact with users and applications and a kernel portion to interact with hardware.
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OS place to store configuration information:
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Normally stored in a database such as the Windows Registry, or in text files, called initialization files.
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How does OS manage hardware?
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By way of device drivers or by using system BIOS (firmware). Sometimes, device drivers are considered part of the OS.
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Hybrid Processors:
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They use a 32-bit core and can work using either a 32-bit instruction set or a 64-bit instruction set.
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Four ways to launch an application
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Start menu, the Search box (Windows 2000/XP Run box), Windows Explorer, or a shortcut icon.
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Notification area
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The right side of the taskbar, which some call the system tray.
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Vista UAC box
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Used to protect the system against malware.
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Service
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A program that runs in the background to support or serve Windows or an application.
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Five key job roles of a PC support technician:
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1. PC support technician
2. PC service technician 3. Retail sales associate 4. Bench technician 5. Help-desk technician |
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(T:F) PC service technicians are usually responsible for ongoing PC maintenance.
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(F) False
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(T:F) Hardware and software products generally have more technical documentation than just a user manual.
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(T) True
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Expert System
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Software that is designed and written to help solve problems.
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Call-tracking
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An electronic system that tracks: (1) the date, time, and length of help-desk or on-site calls; (2) causes of and solutions to problems already addressed; (3) who did what and when; and (4) how each call was officially resolved.
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ATX (Advanced Technology Extended) Form Factor
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1. Developed by Intel in 1995; the most commonly used form factor today.
2. Measures 12\" x 9.6\". 3. CPU & memory sit beside expansion slots. 4. Uses single 20 pin P1 power connector. |
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The P1 pins provide what voltages?
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These pins provided +3.3 volts, +5 volts, +12 volts, -12 volts, and an optional and rarely used -5 volts.
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ATX12V power supply
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A power supply that provides a 4-pin 12-volt power cord.
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ATX Version 2.1 specification
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Added a 4-pin auxiliary connector near the processor socket to provide an additional 12 V of power.
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ATX Version 2.2 Allowed for a 24-pin P1 connector, which is
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backward compatible with the 20-pin P1 connector and supports PCI Express slots. The extra 4 pins on the connector provide +12 volts, +5 volts, and +3.3 volts pins.
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Mini-ATX motherboard
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Is a smaller ATX motherboard (11.2\" × 8.2\") that can be used with ATX cases and power supplies.
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Extended ATX (eATX) motherboard
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Can be up to 12" × 13" in size; it is used in rack-mounted servers.
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Mini-ITX Form Factor
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This form factor is a smaller variation of the MicroATX and is designed for small systems such as a home theatre system.
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FlexATX Form Factor
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A variation of the MicroATX that can be up to 9\" × 7.5\" and is commonly used in slimline and all-in-one cases, but can fit into any FlexATX, MicroATX, or ATX case that follows the ATX 2.03 or higher standard.
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BTX (Balanced Technology Extended) Form Factor
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1. Designed by Intel in 2003.
2. Designed to take full advantage of serial ATA, USB 2.0, and PCI Express technologies. 3. Uses a 24 pin P1 connecter same as ATX. |
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NLX (New Low-profile Extended) Form Factor
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1. Developed by Intel in 1998 to improve on an older and similar form factor, called the LPX form factor.
2. Motherboard has only one expansion slot to mount a riser card. 3. Designed to use ATX power supplies. |
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Midsize towers, also called midi-towers or mid-towers
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Generally have around six expansion slots and four drive bays and are used for ATX, eATX, MicroATX, Mini-ATX, and BTX systems.
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The minitower, also called a microtower
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The smallest type of tower case and does not provide room for expansion. They are popular for MicroATX and FlexATX systems.
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Full-size towers
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Used for high-end personal computers and servers. Usually built to accommodate ATX, Mini-ATX, and BTX systems.
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Volt
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A measure of electrical "pressure" differential, symbol is V.
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Amp
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A measure of electrical current, symbol is A.
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Ohm
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A measure of resistance to electricity, symbol is omega (Ω).
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Watt
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A measure of total electrical power needed to operate a device. While volts and amps are measured for value, watts are calculated. (V x A = W).
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Rectifier
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A device that converts AC to DC.
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Inverter
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A device that converts DC to AC.
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Transformer
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A device that changes the ratio of voltage to current. More voltage, less current to travel long distances. The opposite for homes.
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Transistor
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An electronic device that can serve as a gate or switch for an electrical signal and can amplify the flow of electricity.
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Capacitor
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An electronic device that can hold an electrical charge for a period of time and can smooth the uneven flow of electricity through a circuit.
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Diode
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A diode is a semiconductor device that allows electricity to flow in only one direction.
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Resistor
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A resistor is an electronic device that limits the amount of current that can flow through it.
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Power supply unit (PSU)
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A box inside a computer case that supplies power to the motherboard and other installed devices.
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This mother form factor can measure up to 12" × 9.6" and is the most popular form factor.
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An ATX motherboard.
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A smaller variation of MicroATX that allows for maximum flexibility. Can be up to 9" × 7.5". This motherboard costs less, has fewer features, and is commonly used in slimline and all-in-one cases.
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FlexATX Form Factor
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A charge (either positive or negative, depending on design) placed on the center layer can cause the two outer layers of what device to complete a circuit to create an "on" state?
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A transistor.
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LGA775
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1. First Land Grid Array socket and most popular.
2. Core 2 Extreme, Quad, or Duo, Celerons, and Pentiums. 3. DDR3 and DDR2 memory. |
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LGA1366
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1. Latest Intel socket.
2. Core i7. 3. DDR3 memory. |
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P45, P43, P35, G45, Q45, and G31 Supported Processors.
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Support Core 2 Quad and Core 2 Duo Intel processors. P35 also supports Core 2 Extreme processor.
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LGA771 socket supports
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1. Core 2 Extreme Processor.
2. DDR2 Memory. |
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Socket 478 supports
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1. Pentium 4 and Celeron Processors.
2. Uses a dense micro PGA (mPGA). |
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Socket 423 supports
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1. P4
2. 39 x 29 SPGA grid |
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AM3 or AMD3 Socket supports
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1. Phenom II.
2. 938 holes for pins (PGA). 3. DDR3 memory. |
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AM2+ or AMD2+ Socket supports
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1. Phenom II, Phenom, and Athlon.
2. 940 holes for pins (PGA). 3. DDR2 Memory |
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AM2 or AMD2 Socket supports
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1. Athlon and Sempron.
2. 940 holes for pins (PGA). 3. DDR2 Memory. |
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Socket 754 supports
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1. Athlon and Sempron.
2. 754 holes for pins (PGA). 3. DDR Memory. |
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Socket 940 supports
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1. Athlon.
2. 940 holes for pins (PGA). 3. DDR Memory. |
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Socket 939 supports
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1. Athlon and Sempron.
2. 939 holes for pins (PGA). 3. DDR Memory. |
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Socket A supports
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1. Athlon, Sempron, and Duron.
2. 462 holes for pins (PGA). 3. DDR Memory. |
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975X Express Chipset
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Supports the Pentium Extreme Edition processor, multiple video cards, and up to 8 GB of memory.
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P45, P43, and G45 memory support.
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Can support up to 16 GB of DDR3 or DDR2 memory.
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P35 Chipset memory support.
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Can support up to 8 GB of DDR3 or DDR2 memory.
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G31 chipset memory support.
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Supports up to 4 GB of DDR2 memory.
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Q45 chipset memory support.
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Uses DDR3 or DDR2 memory.
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910GL, 845E, 845G, and 865G chipsets
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1. Support P4, Celeron/Celeron D processors.
2. Use DDR memory. 3. The 910GL chipset uses LGA775 socket. 4. All others use 478PGA socket. |
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845 and 845GL Chipsets
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1. Support P4 or Celeron processors.
2. Support up to 2 GB of DDR memory. |
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Universal PCI card
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Can use either a 3.3-V or 5-V slot and contains both notches.
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Hard boot or cold boot
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Involves turning on the power with the on/off switch.
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The first PCI bus had
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A 32-bit data path, supplied 5 V of power to an expansion card, and operated at 33 MHz.
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The second item in an MBR is a table called
|
The partition table, which contains a map to the partitions on the hard drive.
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PCI Version 2.x introduced
|
the 64-bit, 3.3-V PCI slot, doubling data throughput of the bus.
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System bus
|
1. Bus Type: Local.
2. Data Path in Bits: 64. 3. Address Lines: 32 or 64. 4. Bus Frequency: Up to 1600 MHz. 5. Throughput: Up to 3.2 GB/sec |
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PCI Express Version 2
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1. Bus Type: Local video and local I/O.
2. Data Path in Bits: Serial w/up to 32 lanes. 3. Address Lines: Up to 32 lanes. 4. Bus Frequency: 2.5 GHz. 5. Throughput: Up to 500 MB/sec per lane in each direction. |
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PCI Express Version 1.1
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1. Bus Type: Local video and local I/O.
2. Data Path in Bits: Serial w/up to 16 lanes. 3. Address Lines: Up to 16 lanes. 4. Bus Frequency: 1.25 GHz. 5. Throughput: Up to 250 MB/sec per lane in each direction. |
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PCI Express Version 1
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1. Bus Type: Local video and local I/O.
2. Data Path in Bits: Serial w/up to 16 lanes. 3. Address Lines: Up to 16 lanes. 4. Bus Frequency: 1.25 GHz. 5. Throughput: Up to 250 MB/sec per lane in each direction. |
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PCI-X
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1. Bus Type: Local I/O.
2. Data Path in Bits: 64. 3. Address Lines: 32. 4. Bus Frequency: 66, 133, 266, or 533 MHz. 5. Throughput: Up to 8.5 GB/sec. |
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PCI
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1. Bus Type: Local I/O.
2. Data Path in Bits: 32 or 64. 3. Address Lines: 32 or 64. 4. Bus Frequency: 33, 66 MHz. 5. Throughput: 133, 266, or 532 MB/sec. |
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AGP 1x, 2x, 3x, 4x, 8x
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1. Bus Type: Local Video.
2. Data Path in Bits: 32. 3. Address Lines: NA. 4. Bus Frequency: 66, 75, 100 MHz. 5. Throughput: 266 MB/sec to 2.1 GB/sec. |
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FireWire 400 and 800
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1. Bus Type: Local I/O or expansion.
2. Data Path in Bits: 1. 3. Address Lines: Serial. 4. Bus Frequency: NA. 5. Throughput: Up to 3.2 Gbps. |
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USB 1.1, 2.0, and 3.0
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1. Bus Type: Expansion.
2. Data Path in Bits: 1. 3. Address Lines: Serial. 4. Bus Frequency: 3 MHz. 5. Throughput: 12 or 480 Mbps or 5.0 Gbps. |
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Is PCIe backwards compatible with PCI or PCI-X?
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No.
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PCI Express currently comes in four different slot sizes:
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PCI Express x1, x4, x8, and x16.
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PCI Express x1 slot contains
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A single lane for data, which is actually four wires. One pair is used to send data and the other pair receives data, one bit at a time.
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PCI Express x16 slot contains
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16 lanes, each lane timed independently of other lanes.
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PCI Express Version 1 power
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Allowed for 150 W (75 W from pins on the expansion slot and 75 W from the 6-pin connector from the power supply).
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PCI Express Version 1.1 power
|
Increased the wattage to 225 watts by allowing two 6-pin connectors from the power supply to the card (75 W from the slot and 150 W from the two connectors).
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PCI Express Version 2 power
|
Increased to a total of 300 watts by using a new 8-pin power supply connector that provides 150 W, The 300 watts to the card come from the slot (75 W), from the 8-pin connector (150 W), and an additional 75 W come from a second auxiliary connector on the motherboard.
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|
AGP standards include
|
1. 3 major releases (AGP 1.0, 2.0, and 3.0)
2. 1 major change length (AGP Pro), 3. 4 different speeds (1x, 2x, 4x, and 8x) 4. 3 different voltages (3.3, 1.5, and 0.8) 5. 4 different throughpputs 266, 533 MB/sec, 1.06, and 2.12 GB/sec. 6. 6 different expansion slots (AGP 3.3 V, AGP 1.5 V, AGP Universal, AGP Pro 3.3 V, APG Pro 1.5 V, and AGP Pro Universal). |
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AGP 1.0 and 2.0 length and pins
|
2.9 inches wide and 132 pins.
|
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AGP 3.0 and Pro pins
|
180 pins to provide extra voltage for high-end cards that consume more than 25W of power.
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Soft boot or warm boot
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Involves using the operating system to reboot.
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The functions performed during the boot can be divided into four parts
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1. The startup BIOS runs the POST and assigns system resources.
2. The startup BIOS program searches for and loads an OS. 3. The OS configures the system and completes its own loading. 4. Application software is loaded and executed. |
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The 4 system resources on a mobo that the OS and processor use to interact with hardware are
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IRQ lines, I/O addresses, memory addresses, and DMA channels.
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IRQ numbers
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A line of a mobo bus that a hardware device or expansion slot can use to signal the CPU that the device needs attention.
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I/O addresses
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Numbers assigned to hardware devices that software uses to send a command to the device. Devices "listen" for these numbers and respond to the ones assigned to it.
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Memory addresses
|
Numbers assigned to physical memory located either in RAM or ROM chips.
|
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DMA channels
|
A number designating a channel on which the device can pass data to memory without involving the CPU.
|
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Memory address FFFF0h
|
The memory address always assigned to the first instruction in ROM BIOS startup program.
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A drive is laid out in a series of concentric circles called
|
tracks.
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|
Each track is divided into segments called
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sectors.
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Each sector can hold
|
512 bytes of data.
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On the outermost track, one sector (512 bytes) is designated the
|
"beginning" of the hard drive, the Master Boot Record (MBR).
|
|
The first sector in a drive, the MBR, contains two items.
|
1. The master boot program, which is needed to locate the beginning of the OS on the drive.
2. The partition table, which contains a map to the partitions on the hard drive. |
|
The next sector on the drive, at the beginning of the boot drive (usually drive C) is
|
the OS boot record, which contains a small program that points to a larger OS program file that is responsible for starting the OS load.
|
|
For Windows Vista, the OS boot record program points to
|
BootMgr.
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|
For Windows XP, the OS boot record program points to
|
Ntldr.
|
|
Vista boot loader program
|
BootMgr turns job over to Winload.exe.
|
|
Windows XP boot loader program
|
Ntldr
|
|
The most popular motherboard form factors are
|
ATX, MicroATX, FlexATX, BTX, and NLX, in that order.
|
|
The most popular chipset manufacturers are
|
Intel, AMD, NVIDIA, and SiS.
|
|
A bus is a path on the motherboard that carries
|
Electrical power, control signals, memory addresses, and data to different components on the board.
|
|
The first file that the OS used to load the OS is
|
BootMgr for Windows Vista and Ntldr for Windows XP.
|
|
ROM chips contain
|
the programming code to manage POST and the system BIOS and to change BIOS settings.
|
|
CMOS RAM holds
|
configuration information.
|
|
The BIOS setup program is used to
|
change the settings in CMOS RAM.
|
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A processor contains three basic components:
|
An input/output (I/O) unit, a control unit, and one or more arithmetic logic units (ALUs).
|
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The I/O unit manages
|
data and instructions entering and leaving the processor.
|
|
The control unit manages
|
all activities inside the processor itself.
|
|
The ALU does
|
all logical comparisons and calculations.
|
|
Current Intel processors work with system buses that run at
|
1600, 1333, 1066, or 800 MHz.
|
|
Current AMD processors work with system buses that run at
|
1800, 1000, or 800 MHz.
|
|
Current Intel sockets for desktop systems are the
|
LGA1366, LGA771, LGA775, and 478 sockets.
|
|
AMD's current desktop sockets are
|
AM3, AM2+, AM2, 754, and 940 sockets.
|
|
Memory on the processor die is called
|
Level 1 cache (L1 cache).
|
|
Memory in the processor package, but not on the processor die, is called
|
Level 2 cache (L2 cache).
|
|
Some processors use a third cache farther from the processor core, but still in the processor package, which is called
|
Level 3 cache (L3 cache).
|
|
Intel's Hyper-Threading and AMD's HyperTransport
|
Both allow each logical processor within the processor package to handle an individual thread in parallel with other threads being handled by other processors within the package.
|
|
Enhanced Intel SpeedStep Technology (EIST) and AMD uses PowerNow!.
|
Technologies that put the processor in a sleep state when they are inactive and reduce voltage requirements and CPU frequency depending on the demands placed on the processor.
|
|
Registers
|
Small holding areas on the processor chip that work much as RAM does outside the processor.
|
|
Back-side bus (BSB)
|
The portion of the internal bus that connects the processor to the internal memory cache.
|
|
Inside the processor housing, data, instructions, addresses, and control signals use
|
the internal bus.
|
|
The data portion of the internal bus is called
|
the internal data bus, which is 32 bits wide and connects to each ALU.
|
|
The data portion of the external bus, sometimes called the front-side bus is
|
64 bits wide.
|
|
If the processor operates at 3.2 GHz internally but 800 MHz externally, then
|
the processor frequency is 3.2 GHz, and the system bus frequency is 800 MHz.
|
|
System bus frequency × multiplier =
|
processor frequency
|
|
Throttling
|
If the system overheats, it will throttle down or shut down to prevent permanent processor damage or to reduce power consumption.
|
|
Multiprocessing, Multiple Processors, or Multi-core Processing
|
CPU designers have come up with several creative ways of doing more than one thing at a time to improve performance.
|
|
Multiprocessing is accomplished when a processor contains
|
more than one ALU.
|
|
Multi-core processing
|
The processor housing contains two or more cores that operate at the same frequency, but independently of each other. Each core is a logical processor which contains two ALUs.
|
|
A CPU using multi-core processing can have
|
2 cores (supporting four instructions at once),
3 cores (supporting six instructions), 4 cores (supporting eight instructions), or 8 cores (supporting sixteen instructions). |
|
A memory cache, such as an L1, L2, or L3 cache, is
|
RAM that holds data and instructions that the memory controller anticipates the processor will need next.
|
|
This mobo's size can be up to 9.6" x 9.6" and has fewer expansion slots than an ATX mobo.
|
MicroATX
|
|
This mobo's size can be up to 9" x 7.5"
|
FlexATX
|
|
This mobo can be up to 12" wide and was designed by Intel in 2003 to take full advantage of serial ATA, USB 2.0, and PCI Express technologies
|
BTX
|
|
This mobo can be up to 10.4" wide.
|
MicroBTX
|
|
This mobo can be up to 8" wide.
|
PicoBTX
|
|
This mobo can be up to 9" x 13.6" wide and uses a riser card.
|
NLX
|
|
This device changes and conditions the house electrical current, functioning as both a transformer and a rectifier.
|
Computer Power Supply
|
|
A power supply steps down the voltage from the 110-volt house current to _____ volts, and changes incoming AC to DC, which the computer and its peripherals require.
|
3.3, 5, and 12 volts
|
|
Video cards draw the most power in a system, and they draw from
|
the +12 V output.
|
|
To calculate the rating for continuous operation of a power supply, deduct about __________ off the peak rating.
|
10 to 15 percent
|
|
Use a power supply that is rated about __________ than you expect the system will use.
|
30 percent higher
|
|
Why should you never use a Dell power supply on a non-Dell mobo?
|
Dell ATX power supplies and mobos might not use the standard P1 pinouts for ATX, although the power connectors look the same.
|
|
These devices level the AC to reduce brownouts and spikes.
|
Line conditioners.
|
|
The fast end of the hub, which contains the graphics and memory controller, connects to the system bus and is called
|
the hub’s North Bridge.
|
|
All I/O devices, except display and memory, connect to the hub by using the slower
|
South Bridge.
|
|
If a connector is a group of pins sticking up on the board, the connector is called
|
a header.
|
|
This type of RAM does not need refreshing and can hold its data as long as power is available.
|
Static RAM (SRAM).
|
|
Where is the memory controller on the Core i7 processor?
|
Inside the processor package.
|
|
First technology to support repetitive looping, whereby the processor receives an instruction and then applies it to a stream of data that follows.
|
MMX (Multimedia Extensions)
|
|
It allows the CPU to receive a single instruction and then execute it on multiple pieces of data. SSE also improves on 3D graphics.
|
SSE (Streaming SIMD Extension)
|
|
SIMD stands for
|
“single instruction, multiple data.”
|
|
A processor instruction set designed to improve performance with 3D graphics and other multimedia data.
|
3DNow! by AMD.
|
|
This feature increases performance and lowers power requirements.
|
PowerNow! by AMD.
|
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This feature lowers power requirements and helps keep a system quiet.
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Cool’n’Quiet by AMD.
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This technology steps down processor frequency when the processor is idle to conserve power and lower heat.
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Enhanced Intel SpeedStep Technology (EIST) by Intel.
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A security feature that prevents software from executing or reproducing itself if it appears to be malicious.
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Execute Disable Bit by Intel.
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A heat sink carrying an electrical charge that causes it to act as an electrical thermal transfer device.
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A peltier.
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|
The current set of standards that is used by BIOS, hardware, and the OS to manage power is
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Advanced Configuration and Power Interface (ACPI).
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In this state, the hard drive and monitor are turned off and everything else runs normally.
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S1 state.
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|
In this state, the hard drive, monitor, and processor are turned off.
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S2 state.
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In this state, everything is shut down except RAM and enough of the system to respond to a wake-up call such as pressing the keyboard or moving the mouse.
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S3 state.
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In this state, everything in RAM is copied to a file on the hard drive and then the system shuts down. Later, when a power button is pressed, the system does not have to go through the slow boot process, but can quickly read contents of the hibernation file and restore the system to exactly as it was before the state was enabled.
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S4 state is called hibernation.
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ACPI also defines CPU ___, which save power by lowering the CPU frequency and voltage.
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P states.
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P0 has the ____ frequency and higher P state values have _____ frequencies.
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highest, lower
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___ and ____ implement these P states if the technology is enabled in BIOS setup.
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EIST and PowerNow!
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___ states, also defined by ACPI, are used by the processor to stop its internal operations to conserve power.
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C states
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|
Using ___ though ___ states, the processor shuts down various internal components to conserve power.
|
C1 through C6 states
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|
The _____ the C state, the longer it takes for the processor to wake up.
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deeper
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|
The temperature inside the case should never exceed
|
100 degrees F (38 degrees C).
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|
A round air duct that helps to pull and direct fresh air from outside the case to the cooler and processor.
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Chassis air guide.
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The __ cache is shared by all cores.
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L3 cache
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|
Computing technologies a processor can use include
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MMX, SSE, SSE2, SSE3, SSE4, and 32-bit and 64-bit processing.
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|
A 4-pin CPU fan header on the mobo supports pulse width modulation (PWM) that controls fan speed in order to
|
reduce the overall noise in a system.
|
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Groups of instructions that accomplish fundamental operations, such as comparing or adding two numbers, are permanently built into the processor chip.
|
microcode.
|
|
_____________ increases the instruction set to improve 3D imaging for gaming and improve performance with data mining applications.
|
SSE4
|
|
Laptops use a smaller version of a DIMM called a
|
SO-DIMM (small outline DIMM).
|
|
________ are used on subnotebook
computers and are smaller than SO-DIMMs. |
MicroDIMMs
|
|
240-pin DIMM, is currently the fastest memory, it can support triple or dual channels or be installed as a single DIMM. Has one offset notch.
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DDR3
|
|
240-pin DIMM, can support dual channels or be installed as a single DIMM. Has one notch near the center of the edge connector.
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DDR2
|
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184-pin DIMM, can support dual channels or be installed as a single DIMM. Has one offset notch.
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DDR
|
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168-pin DIMM, has two notches on the module. The positions of these notches depend on the memory features the DIMM uses.
|
SDRAM
|
|
Has 184 pins and two notches near the center of the edge connector.
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RIMM
|
|
Must be installed two modules to a bank of memory.
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72-pin SIMM
|
|
Must be installed four modules to a bank of memory.
|
30-pin SIMM
|
|
Most desktop and laptop processors address memory ___ bits at a time.
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64 bits.
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|
Double-sided DIMMs that provide two 64-bit banks are said to be
|
dual ranked.
|
|
Some double-sided DIMMs are single ranked, meaning
|
that all chips on both sides of the DIMM are addressed at every read or write.
|
|
Single-ranked DIMMs cost __ but perform ____ because the controller accesses all chips at the same time.
|
more, better
|
|
A PC rating is a measure of
|
The total bandwidth of data moving between the module and the CPU.
|
|
The data path width for DIMMs is normally 64 bits, but with ECC, the data path is
|
72 bits.
|
|
_____ and _____ hold data and amplify a signal just before the data is written to the
module. |
Buffers and registers
|
|
The position of the notch on the left identifies the module as
|
registered (RFU), buffered, or unbuffered memory.
|
|
The notch on the right identifies the
|
voltage used by the module.
|
|
Two ways of measuring access timing.
|
CAS Latency (CAS stands for “column access strobe”) and RAS Latency (RAS stands for “row access strobe”)
|
|
RIMMs that use a 16-bit data bus have ___ notches and ___ pins. RIMMs that use a 32-bit data bus have a single notch and ___ pins.
|
two notches, 184 pins, 232 pins
|
|
If a slot does not hold a RIMM, it must hold a placeholder module called a ____ to ensure continuity throughout all slots.
|
C-RIMM (Continuity RIMM)
|
|
______ can be used with 30-pin or 72-pin SIMMs or some really old 168-pin DIMMs.
|
FPM (fast page memory)
|
|
______ improved on FPM and is used on 72-pin SIMMs or some 168-pin DIMMs.
|
EDO (extended data out)
|
|
_______ improved on EDO, but was rarely used. You might encounter it on some 72-pin SIMMs or 168-pin DIMMs.
|
Burst EDO (BEDO)
|
|
___ is a DIMM technology that declares to system BIOS at startup the module’s size, speed, voltage, and data path width.
|
Serial Presence Detect (SPD)
|