Comptia A+ Certification Practice Test 6 (Exam 220-901)

Front 1

What are the units used for measuring the clock speed of modern CPUs?

Back 1

GHz

IPS

Front 2

A type of CPU architecture where a single physical CPU contains more than one execution core on a single die or chip is known as:

Back 2

Multicore

Front 3

True or False?

The Land Grid Array (LGA) is a type of integrated circuit packaging that is notable for having pins arranged in a regular array on the underside of the package.

Back 3

False

Front 4

Hardware enhancements adding support for virtualization developed by AMD for its CPUs are known as:

Back 4

AMD-V

Front 5

What are the characteristic features of Socket T?

Back 5

775 contacts

LGA packaging

Intel CPU socket

Front 6

What provides a CPU with the fastest access to frequently used data?

Back 6

Multi-level cache

Front 7

The NX bit technology implemented in CPUs manufactured by Intel is called:

Back 7

XD bit

Front 8

What are the characteristic features of Socket H2?

Back 8

LGA packaging

1155 contacts

Intel CPU socket

Front 9

A CPU design based on instruction set that tries to improve speed by utilizing relatively few and simple instructions is known as:

Back 9

RISC (Reduced instruction set computing)

Front 10

True or False

The Pin Grid Array (PGA) is a type of surface-mount packaging for integrated circuits (ICs) that is notable for having pins on the socket rather than the integrated circuit.

Back 10

False

Front 11

True or False

The Land Grid Array (LGA) is a type of surface-mount packaging for integrated circuits (ICs) that is notable for having pins on the socket rather than the integrated circuit.

Back 11

True

Front 12

What are the characteristic features of Socket H/H1?

Back 12

1156 Contacts

LGA packaging

Intel CPU socket

Front 13

The bus between the CPU and the internal memory cache (L2 cache) inside the CPU housing is called:

Back 13

Back-side bus (BSB)

Front 14

A set of Intel CPU hardware enhancements improving support for virtualization is known as:

Back 14

VT-x

Front 15

What are the characteristic features of Socket B?

Back 15

1366 contacts

Intel CPU socket

LGA packaging

Front 16

The bus between the CPU and northbridge is called:

Back 16

Front-side bus (FSB)

Front 17

An additional ATX12V power connector designed to supply dedicated power for the CPU is known as:

Back 17

P4 connector

Front 18

What are the characteristic features of Socket H3?

Back 18

1150 contact pins

PGA packaging

Intel CPU socket

Front 19

What is the acronym that refers to a specific feature of certain types of microprocessor sockets that facilitates the insertion and removal of a CPU chip?

Back 19

ZIF (Zero insertion force)

Front 20

What is the name of a microprocessor component that performs all comparisons and calculations?

Back 20

ALU (Arithmetic logic unit)

Front 21

What are the types of Intel CPUs designed for desktop and workstation computers?

Back 21

Celeron

Pentium

Core i3

Core i5

Core i7

Front 22

What is the name of a server-dedicated CPU series designed by AMD?

Back 22

Opteron

Front 23

Which of the following answers refer to the characteristics of Socket R?

Back 23

2011 contacts

Intel CPU socket

LGA packaging

Front 24

Intel CPU server brands include:

Back 24

Xeon

Itanium

Front 25

The NX bit technology implemented by AMD in its CPUs is known as:

Back 25

EVP (Enhanced Virus Protection)

Front 26

The AMD CPU brands designed for desktop and workstation computers include:

Back 26

Athlon

Sempron

Phenom

FX

Front 27

True or False?

The Pin Grid Array (Pin Grid Array) is a type of integrated circuit packaging that is notable for having pins arranged in a regular array on the underside of the package.

Back 27

True