INTRODUCTION
1.1 :R[1] MEMS (Micro Electro Mechanical Systems) are innovative microfabricated devices with critical dimensions in the range of 1 to 1000µm. These devices are electro-mechanical structures whose complexity varies from a simple actuator to a highly complex electromechanical system performing a wide variety of sensing and control. Introduced in the early 60’s the development of this technology has been growing tremendously. It has been the pioneer in sensor and other applications. MEMS when integrated with an ASIC (Application Specific Integrated Circuit) reduces the need for complex external circuitry and provides a more reliable operation. R[6]. MEMS was developed with a lot of technologies and process similar to the IC industry …show more content…
One of the major difference is that an IC is a purely a miniaturized electrical circuit where as a MEMS sensor has mechanically moving devices in addition to the electrical circuitry. Other differences are as listed below:
[R10] Variation in fabrication steps of an IC vs MEMS include but not limited to the feature size (MEMS require a larger feature size – 0.5 to 1µm whereas IC require a feature size of 0.025µm), mechanical properties (MEMS devices require care greater on Young’s modulus, stress, stability than IC’s), release process (MEMS devices need to be either dry or wet etched). In addition to MEMS devices have to be considered for stiction which occurs due to the adhesive forces acting between the substrate and the movable devices. Capillary forces, electrostatic attraction, and chemical bonding are other forms of stiction caused while the device is been used. Another important variation is in packaging the MEMS devices, for example the packaging technique used for an accelerometer cannot be used for packaging a piezo
1.1 :R[1] MEMS (Micro Electro Mechanical Systems) are innovative microfabricated devices with critical dimensions in the range of 1 to 1000µm. These devices are electro-mechanical structures whose complexity varies from a simple actuator to a highly complex electromechanical system performing a wide variety of sensing and control. Introduced in the early 60’s the development of this technology has been growing tremendously. It has been the pioneer in sensor and other applications. MEMS when integrated with an ASIC (Application Specific Integrated Circuit) reduces the need for complex external circuitry and provides a more reliable operation. R[6]. MEMS was developed with a lot of technologies and process similar to the IC industry …show more content…
One of the major difference is that an IC is a purely a miniaturized electrical circuit where as a MEMS sensor has mechanically moving devices in addition to the electrical circuitry. Other differences are as listed below:
[R10] Variation in fabrication steps of an IC vs MEMS include but not limited to the feature size (MEMS require a larger feature size – 0.5 to 1µm whereas IC require a feature size of 0.025µm), mechanical properties (MEMS devices require care greater on Young’s modulus, stress, stability than IC’s), release process (MEMS devices need to be either dry or wet etched). In addition to MEMS devices have to be considered for stiction which occurs due to the adhesive forces acting between the substrate and the movable devices. Capillary forces, electrostatic attraction, and chemical bonding are other forms of stiction caused while the device is been used. Another important variation is in packaging the MEMS devices, for example the packaging technique used for an accelerometer cannot be used for packaging a piezo