# Heat Transfer Rate Essay

Chinmay P Patil (Author)

B.E Student, Dept. of Mechanical Engineering, LTCoE, Koparkhairane.

Abstract—The most important factor in any heatsink is to dissipate heat as quickly as possible. This is due to the fact that these heatsinks are used usually on electronic circuits which can’t not withstand extreme temperatures and can endure damages. Thus to prevent such a damage design of proper heat sink is necessary and can prove fruitful. Electronic devices like CPUs are susceptible to permanent damage if their working temperature exceed desired limit. Thus in order to prevent such a damage it is necessary to design a heat sink with proper geometry of fins which are used. This paper entails comparison

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are modified as well as improved models of Fig 1. And 2 respectively. There is reduction in weight of these two model as the amount of material required is less as compared their counterparts. Fig .3 Uninterrupted or continuous rectangular heat sink with through holes Fig.4 Interrupted rectangular heat sink with through holes

It is to be noted that because of provision of through holes, passage of air takes place via these holes and the overall effect may result in more heat transfer rate.

IV. GEOMETRY

The rectangular heatsinks used for electronic devices are arranged up in inline positions as shown in all the figures. According to length and number of fins, the dimensions of base on which the fins rest, is decided. However, the dimensions decided in this study is as follows: - Fig .5 Geometry of fins [All dimension in mm]

V. ANALYSIS

The CFD analysis id done on Ansys 16.0 Workbench. However, some assumptions and material properties are predetermined

A. Material anad surrounding properties

Material - Structural Steel.

Thermal Conductivity[k]: - 20 to 45 W/mK

Convective heat transfer coefficient: - 55W/m2 o C

Temperature of Base Plate: - 150