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6 Cards in this Set
- Front
- Back
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CPU versions |
DIP - Dual In-line Package. SECC - Single Edge Contact Cartridge. PGA - Pin Grid Array. - Connects to a ZIF socket. LGA - Land Grid Array - A PGA reversed. |
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Dual In-line Package(DIP-old version -no longer used) |
Easily breakable pins. (Intel 8088 vers.) |
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Single Edge Contact Cartridge(SECC - started with Pentium II) |
Single slot- easier to Install. Downsize - Takes to much room because of the Heat Sink needed |
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Pin Grid Array(PGA) |
The Pins at the bottom connect with the MOBO socket. Similar to PnP(plug and play) |
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Zero Insertion Force(ZIF) Socket |
CPU lays on top with no pressure needed, just lock in place. Socket 370 vers. |
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Land Grid Array(LGA) - Reverse PGA |
Pins are on the MOBO. Found on new type of processor(Intel Sandy Bridge i3,i5,i7, AMD, etc). LGA 1155 vers. |
