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24 Cards in this Set
- Front
- Back
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Etching in printmaking?
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Removing unprotected parts of a metal
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Etching in microfabrication
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removes layers from a wafer using chemicals
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Wafer
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Thin Slice of a semiconductor material - like silicon crystal
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Two figures of merit in etching?
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Isotropy and selectivity
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Isotropic etchant creates ------- corners
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Round
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Anisotropic creates ------ corners
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Vertical edged corners
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Anisotropic wet etching has its variations based on....
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...what face is exposed!
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Tropy in Plasma etching
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...isotropic
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Reasons of isotropy in plasma etching
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radicals that attack from everywhere!
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Sputtering uses what kind of ions?
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Noble gas ions
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Pressure requirements in sputtering
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very very low pressure
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Contrast plasma etching and sputtering
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1) Tropy extreme, former isotropic, latter anisotropic [?] [Check again]
2) Moderate pressure versus low pressure |
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Selectivity in Sputtering
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Physical - energy is transferred - anything works!
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Photolithography in MEMS
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SELECTIVELY remove parts of a thin film/bulk of a substrate - Transfers geometric pattern from a photo mask to a photoresist.
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Use of CVD?
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To produce thin films
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Substrate in CVD?
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It's the Wafer
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CVD in terms of purity?
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High purity and high performance solid materials.
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CVD is a kind of *D*eposition. It deposits in what forms? [Think arrangement of atoms.]
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Mono/Poly Crystalline, amorphous and Apitaxial
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Synthetic diamonds can be produced by...
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CVD
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PVD deposits thin films by... (relate *PHYSICAL*)
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Condensation of vapour
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PVD's use for ........ film
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THIN. Very THIN. Even Atomic Layers.
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Sputtering + PVD? [Sputtering is used in Etching too, so...] = Sputter Deposition
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Source ejects and then deposits itself. [Etching is removing. CHECK]
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The constraint in Sputtering Deposition over molecular mass...
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Mechanism - Momentum transfer. So, its good to have ions/particles that are of comparable mass. [??]
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Sputtering Deposition - Temperature.
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Low. So, can be used downstream [Remember the constraint on melting point, process flow of high to low temp]
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